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N-EXPO 2014 TOKYO

"N-EXPO 2014 TOKYO"는 환경의 다양한 문제에 대응하는 다양한 기술과 서비스를 전시합니다. 그것은 순차적으로 작년에 "환경 사업의 개발"을 테마, 그리고 사람들의 안정성과 환경 관련 산업의 발전을 위해 목표로하고 있습니다. 2014년 5월 27일 (화요일)부터 30 일 금요일까지 네 일. 장소는 도쿄 빅 사이트입니다. N-EXPO 2014 TOKYO의 공식 홈페이지 :https://www.nippo.co.jp/n-expo014/

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N-EXPO 2014 TOKYO

“2014新環境展（N-EXPO 2014 TOKYO)」是為應對環境的各種問題的各樣的技術與服務的展示會 這次也和去年繼續“環境商務的展開”為主題，以人們的生活的安定與環境相關產業的發展為目的。 2014年5月27日(星期二)～30日(星期五)為期4天。會場在東京有明國際展覽中心。 2014新環境展的官方網站：https://www.nippo.co.jp/n-expo014/

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N-EXPO 2014 TOKYO

"Expo del N 2014 TOKIO" es una exhibición de varias técnicas y servicios que corresponden a los varios problemas del ambiente. Ofrece el tema de "desarrollo del negocio medioambiental" secuencialmente el año pasado y apunta para el desarrollo de estabilidad de las personas y el negocio de eco. Cuatro días de de martes, mayo 27, 2014 a 30 viernes. El sitio de una acción es Tokio la Vista Grande. El homepage oficial de Expo del N 2014 TOKIO:https://www.nippo.co.jp/n-expo014/

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溫度可變基板彎曲檢查裝置”HVI – 5020 EX – KN” – 東光高嶽股份有限公司

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新時代型的搬運工具 “MagiCarrier” – 京寫股份有限公司

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JPCA Show 2014

"JPCA Show 2014" （44th International Electronic Circuits Exhibition） covered all a product and technical service about production and the development of the electronic circuit. The theme of this year is that "pick up, tie, make and widen every product abd technique." As for the co-exhibition, "Large Electronics Show 2014", "WIRE Japan Show 2014" (Electric wire, Cable, and Connector Exhibition), "2014 Microelectronics Show" (28th Advanced Electronics Packaging Exhibition), "JISSO PROTEC 2014" (16th Jisso Process Technology Exhibition) is held. A session is three days of Friday for from Wednesday, June 4, 2014 to 6th. The venue is Tokyo Big Sight. The official homepage of JPCA Show 2014: http://www.jpcashow.com/show2014/index.php [button color="#FFFFFF" background="#008000" size="medium" src="/contents/tag/jpca-show-2014"]Movie List >[/button]

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Self-sustained slide / three-dimensional shape FPC – Oki Electric Cable Co., Ltd. (JPCA Show 2014)

They introduces the FPC which has an appropriate rigidity, and enables self-sustained slide without the bending and twisting and also the FPC with newly movable mechanism by the three-dimensional shape. WebSite：http://www.okidensen.co.jp/jp/ [toggle_box][toggle_item title="Script" active="false"] It is Oki Electric Cable Co., Ltd. We display the flexible printed circuit "Self-sustained slide / three-dimensional shape FPC". At first I explain the Self-sustained slide FPC. This gives form of U to an FPC, and sliding is thereby possible by moderate rigidity. I display two kinds of a general self-sustained slide FPC, and the one with a shield that raised anti-noise characteristics this time. I explain the three-dimensional shape FPC next. This is the FPC which can keep a free solid shape to an FPC. As for what I display this time, the bellows shape FPC that the expansion and contraction is possible, and the spiral shape FPC that three-dimensional movement and expansion and contraction movement are possible. We are good at a long FPC. We can make the dynamic solid shape FPC which can operate in this way. [/toggle_item][/toggle_box]

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High precision cutting technology for binderless hard metal – Kyoei Print Giken Co., Ltd. (JPCA Show 2014)

They introduce a technique to process binderless hard metal considered to be difficult to cut.

WebSite：http://www.kpg.jp/
[toggle_box][toggle_item title="Script" active="false"]
I explain binderless hard metal, exhibiting this time.
This is said to be difficult-cut materials.
As for the binderless, there is no binder of the hard metal.
Therefore it is the materials which it is very fragile, and have difficult processing.
Using this, there is the merit that comes to resist heat.
Usually, problems such as cobalt's flowing-out occur when in a high temperature.
Processing of the binderless hard metal is possible without a problem in us.
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Temperature variableness board curving tester “HVI-5020EX-KN” – TAKAOKA TOKO CO.,LTD. (JPCA Show 2014)

They introduce the tester of board bends under a variety of temperature environment, with high speed and highly precise.

WebSite：http://www.tktk.co.jp/
[toggle_box][toggle_item title="Script" active="false"]
I explain our] temperature variableness board device.
This device is what can inspect with variable temperature.
As an object, I assume boards.
The main specifications of this product is
"precision of the inspection", and "speed of the inspection".
The reason that is high in precision of the inspection is because our device uses the cofocus method.
We are proud of repetition precision of the order by the approximately 1-0.1 microns unit.
As for the inspection speed, usuallly, it takes approximately one hour for heating of the order and handling of original heat.
However, this product succeeds in shortening speed until about 15-20 minutes.
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Next-generation conveyance carrier “MagiCarrier” – KYOSYA CO.,LTD. (JPCA Show 2014)

They introduce a conveyance carrier using the adhesion resin which is usable 1,000 times repeatedly and is strong in heat. It is used for FPC board implementation, microparts and board conveyance

WebSite：http://www.kyosha.co.jp/
[toggle_box][toggle_item title="Script" active="false"]
It is Kyosya Co., Ltd.
This product is MagiCarrier.
This product is a board for conveyance using the adhesive strength.
This is a dummy film, but adhesion resin is applied to this board.
Please use it to stick flex board,
lightweight thin parts or microparts on this board.
I explain the main usage.
For example, in the case of the implementation process of the flex board, I stick flex board on this board.
I do the mount implementation of printing the cream solder and parts.
This resin in itself has heat resistance of around 260-280 degrees.
I just put it in a furnace of the reflow.
I sticks the thin flex board which is hard to treat
or a thin ceramic substrate on the rigid board.
It can expect improvement of conveyence and the productivity of the process, improvement of the quality by managing this.
There are S type, corresponding to flex board and polish surface work, and a weak adhesion type.
And there are strong M type of the adhesive strength, H type, 3H type.
This has the very strong adhesion.
The boards which is hard to stick,
such as with the porous surface structure or ceramic substrate can process flow using the strong adhesiveness.
The most characteristic of the product is
the heat resistance in comparison with normal adhesive tape, and usable repeatedly.
When it is a reflow process, around 1000 times it can usually flow.
People fixed a board with disposable polyimide tape so far.
It can expect the effect of the reduction in cost very much in comparison with that, too.
With the above, I finish the explanation of our product.Thank you.
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